PRODUCTS

PROVIDE OVERALL SOLUTION FOR SEMICONDUCTOR PACKAGING PROCESS

High precision optical measuring machine

It is applicable to the measurement of the external dimension and height difference of optical communication modules, active borderless devices, optical chips, electrical chips, thin film metallized substrates and other separation devices

Sorter

It is suitable for transplanting and preparing components in advanced packaging fields such as communication module, power module, sensor module, camera module, etc

Chip mounter

This product is suitable for various mounting applications in semiconductor fields such as integrated circuits, optoelectronic devices, discrete devices and sensors

AOI optical appearance inspection machine

This product is applicable to the multi-faceted detection of the appearance defects of various optical communication modules, active limbless devices, optical chips, electrical chips, thin film metallized substrates, etc

Chuangkai Intelligent Equipment (Wuxi) Co., Ltd

We focus on the R&D and manufacturing of high-precision semiconductor equipment and provide overall solutions for semiconductor packaging process.

Tel : 0510-82391833 / 82391803

E-mail : cec@wxcec.com

Address : 35-107 Changjiang South Road, Xinwu District, Wuxi City

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