Pick-and-Place Machine
This product is suitable for a wide range of mounting applications in the semiconductor industry, including integrated circuits, optoelectronic devices, discrete components, and sensors.
More precise chip mounting
More flexible adaptation to product switching
Healthier Production Control
Product List
Application Fields
Automotive electronics field
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.
Optical communication field
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.
Consumer Electronics
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.