Sorting Machine
Component transfer and material preparation for advanced packaging applications such as communication modules, power modules, sensor modules, and camera modules.
High-precision sorting, controllable pick-and-place force, MAP counting and picking, classification
Wafer to Wafer, Wafer to Tray, Tray to Wafer
Multi-variety processing, 90° and 180° flipping, and automatic loading/unloading.
AOI module can be added.
Product List
Application Fields
Automotive electronics field
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.
Optical communication field
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.
Consumer Electronics
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.