Measuring Instrument
Measurement of the external dimensions and height differences of discrete components such as optical communication modules, active and passive devices, optical chips, electrical chips, and thin-film metallized substrates.
Height measurement
Flatness Measurement
Dimensional measurement
Resolution: 0.1 µm
AOI module can be added.
Product List
Application Fields
Automotive electronics field
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.
Optical communication field
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.
Consumer Electronics
The company is positioned to provide end-to-end solutions for semiconductor packaging processes, conducting specialized research on the technical and process challenges faced in key steps such as die attachment, inspection, laminating, and testing, and achieving numerous technological breakthroughs.