CHUANG KAI
Component transfer and material preparation for advanced packaging applications such as communication modules, power modules, sensor modules, and camera modules.
High-precision sorting, controllable pick-and-place force, MAP counting and picking, classification
Wafer to Wafer, Wafer to Tray, Tray to Wafer
Multi-variety processing, 90° and 180° flipping, and automatic loading/unloading.
AOI module can be added.
This product is suitable for a wide range of mounting applications in the semiconductor industry, including integrated circuits, optoelectronic devices, discrete components, and sensors.
More precise chip mounting
More flexible adaptation to product switching
Healthier Production Control
Measurement of the external dimensions and height differences of discrete components such as optical communication modules, active and passive devices, optical chips, electrical chips, and thin-film metallized substrates.
Height measurement
Flatness Measurement
Dimensional measurement
Resolution: 0.1 µm
AOI module can be added.
