DT-K03 Covering Chip Mounter
DT-K03 Covering Chip Mounter
Category:
The DT‑K03 is designed for high‑precision chip‑mounting of components ranging from 5×5 mm to 25×25 mm and larger. It integrates dual‑station dispensing, component placement, and heating/UV curing into a single, seamless process. Powered by a multi‑axis servo system and a five‑camera vision‑based positioning system, it features adaptive visual alignment and a fully automated loading/unloading system, enabling effortless compatibility with multiple part types.
Keywords: DT-K03 Covering Chip Mounter
Product Introduction
The DT‑K03 is designed for high‑precision chip‑mounting of components ranging from 5×5 mm to 25×25 mm and larger. It integrates dual‑station dispensing, component placement, and integrated heating/UV curing into a single process. Equipped with a multi‑axis servo system and a five‑camera vision‑based positioning system, it also features adaptive visual alignment and a fully automated loading/unloading system, enabling seamless compatibility across multiple product variants.
Product Specifications
| System Capability | Automatic Loading/Unloading | ||
| Throughput | 2K (Standard Chip) | Loading Method | Fixture → Magazine Loading Module Wafer Ring → Cassette Loading Module |
| Bonding Accuracy | ±0.020mm @3σ | Unloading Method | Fixture → Magazine Loading Module |
| Angular Accuracy | ±0.3° @3σ | Facility Requirements | |
| Material Handling Capability | Compressed Air | >0.6 Mpa | |
| Bonded Product Size | 18×18mm to 45×45mm | Vacuum | >-8 bar |
| Bonded Product Thickness | >0.076mm | Voltage | AC 220V |
| Product Feeding Formats (Optional) | Tray: 2" / 4" Wafer: 12" / 8" / 6" | Power | 18KW |
| Bond Head System | Equipment Dimensions and Weight | ||
| Force Control Capability | 50~300g ±10% | Dimensions | 3600mm × 1820mm × 2100mm |
| Angle Correction Range | 0~360° ±10° | Weight | 2500Kg |
Related Products
Leave a Message Online
If you have any suggestions, please leave a message or send us an email, and we will get back to you as soon as possible after receiving your message.