DT-K01 High-Precision Chip Mounter
DT-K01 High-Precision Chip Mounter
Category:
The equipment features a CCD vision alignment system, ensuring high‑precision component placement; it is compatible with multiple pick‑and‑place processes and materials, and includes foolproof feed‑inspection to effectively safeguard yield. It supports fully automated loading and unloading, along with multi‑bin buffer zones, enabling efficient, continuous production; its rapid material‑change capability meets the demands of flexible manufacturing. An innovative stacked‑layer mounting process breaks through conventional application limits, and it supports MES interfaces for seamless integration with smart‑factory systems.
Keywords: DT-K01 High-Precision Chip Mounter
Product Introduction
● Excellent compatibility, suitable for a variety of surface-mount technologies.
● Suitable for a wide range of materials, with high placement accuracy.
● CCD alignment
● Incoming Material Poka-Yoke Inspection
● Supports MES interface
● Fully automatic loading and unloading
● Multi-material hopper buffer zone
● Quick material changeover function
● Innovative stacked-layer packaging approach
Product Specifications
| System Capability | |
| Throughput | 300 (Standard Chip) |
| Bonding Accuracy | ±0.005mm @3σ |
| Angular Accuracy | ±0.1° @3σ |
| Material Handling Capability | |
| Bonded Product Size | 1×1mm to 25×14mm |
| Bonded Product Thickness | > 0.076mm |
| Product Feeding Formats (Optional) | Tray: 2" / 4" Wafer: 12" / 8" / 6" |
| Bond Head System | |
| Force Control Capability | 50~300g ±10% |
| Angle Correction Range | 0~360° ±0.1° |
| Automatic Loading/Unloading | |
| Loading Method | Fixture → Magazine Loading Module Wafer Ring → Cassette Loading Module |
| Unloading Method | Fixture → Magazine Loading Module |
| Facility Requirements | |
| Compressed Air | >0.6 Mpa |
| Vacuum | >-8 bar |
| Voltage | AC 220V |
| Power | 14KW |
| Equipment Dimensions and Weight | |
| Dimensions | 2850mm × 1530mm × 1850mm |
| Weight | approx. 1900Kg |
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