DT-M5 FO-PLP package placement machine
DT-M5 FO-PLP package placement machine
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This equipment features high-precision motion control and a fully closed-loop pressure system, with a mounting pressure range of 0.15–35 N and an accuracy of ±0.5 N; X/Y positioning accuracy is ±5 μm, and angular accuracy is ±0.05°. It supports one‑click switching between flip‑chip and surface‑mount processes, achieving an UPH of 5,000–7,000 components per hour. The maximum fixture size is 380 × 380 mm, and the maximum mounting area is 300 × 300 mm, meeting the stringent demands of semiconductor back‑end packaging and advanced microelectronics assembly for precision, efficiency, and compatibility.
Keywords: DT-M5 FO-PLP package placement machine
Product Introduction
● Mounting pressure: (0.15–35) ± 0.5 N
● Mounting method: Flip-chip and wire-bonding mode switching
● X/Y accuracy: ±5 μm at 3σ
● Angular accuracy: ±0.05° at 3σ
● UPH: 5–7K (including post-bonding time)
● Maximum fixture size: 380 × 380 mm
● Maximum mounting area: 300×300 mm
Product Specifications
| NO | Item | Parameter | Remarks |
| 1 | X/Y Placement Accuracy | ±5μm (Standard Chip) | Higher accuracy available upon consulting the manufacturer |
| 2 | θ Placement Accuracy | ±0.05° | |
| 3 | Placement Force | Thermal Head: Adjustable from ±0.15 to 35N | |
| 4 | Number of Placement Heads | 4*ZR30 | Placement head spacing: 32mm |
| 5 | Chip Size | 0.20.2-2525mm | Standard camera FOV max support: 8*9mm. Chips larger than FOV require tiled imaging. |
| 6 | Substrate Size | Fixture max support: 380380mm. Placement area max support: 300300mm | Optional fixture base max support placement area: 600*300mm |
| 7 | Wafer Feeding System | Standard: 12-inch | Optional 6/8-inch modes |
| 8 | Flux | Supported | |
| 9 | Vision System | Dynamic compensation for placement accuracy | Supports top and bottom camera position calibration |
| 10 | Equipment Dimensions | 1275 × 1620 × 1550mm (Main Unit) | Footprint: 155018501620mm |
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