DT-S2 High-Precision Eutectic Chip Mounter
DT-S2 High-Precision Eutectic Chip Mounter
Product Introduction
This equipment features a dual-channel architecture, paired with full‑closed‑loop precision pressure control (20 g–200 g, ±5 g resolution) and a dual‑pulse temperature‑control system, enabling high‑efficiency die attach and superior bonding quality. It supports in‑line flatness inspection and automatic leveling, and can be optionally equipped with end‑to‑end visual inspection and chip flip‑chip mounting capabilities, meeting the stringent demands of advanced packaging for accuracy, efficiency, and compatibility.
● Dual-channel structural arrangement
● Fully closed-loop pressure control, with a pressure range of 20 g–200 g and a resolution of ±5 g.
● Dual-pulse temperature control for the mounting stage and bonding head
● Online flatness inspection and automatic leveling of the mounting platform
● Full-Process Visual Inspection of Chips
● Supports chip flip-chip and flip-chip mounting options
Product Specifications
| NO | Item | Parameter | Remarks |
| 1 | X/Y Placement Accuracy | ±2μm (Standard Chip) | Higher accuracy available upon consulting the manufacturer |
| 2 | θ Placement Accuracy | Thermal Head: ±0.05°/Standard ZR: ±0.1° | |
| 3 | Placement Force | Thermal Head: Adjustable from ±0.15 to 50N | Optional ±0.5 to 500N |
| Standard ZR: Adjustable from ±0.5 to 8N | Optional ±0.15 to 8N | ||
| 4 | Bond Head Temperature | Thermal Head Maximum Temperature: 300°C | Optional 450°C |
| Heating Method: Constant Temperature | Optional Pulse Heating | ||
| 5 | Heating Stage | Pulse Heating Maximum Temperature: 450°C | |
| Heating Rate: 100°C/S | |||
| Cooling Rate: 30°C/S | |||
| Three-Point Auto Leveling | Optional Manual Leveling | ||
| Heater Plate Size: 12*22mm | |||
| 6 | Placement Size | 0.25-15*0.25-15mm | |
| 7 | Wafer Feeding System | Standard: 12-inch | Optional 6/8-inch modes |
| 8 | Ejector Pin Quick Change | 5-station ejector pin quick change | |
| 9 | Waffle Pack | 2*2/4 Waffle Pack | |
| 10 | Equipment Dimensions | 1260 × 2100 × 1450mm (Main Unit) | Footprint: 130025001700mm |
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